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2Layer-2

The Manufacturing Process Part 2 (Double Sided)

This is part 2 of the quick overview of the manufacturing processes involved in making a normal circuit board.

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Continued

Pattern Plate Cu.
This is where the real platting will happen. The inside of the holes and the surface of the pads & traces will get the required copper platting to meet the prints requirements.

Solder Plate

Inspection

Etch

Strip Resist

Inspection

Solder Mask
This can be an LPI, Dry Film or a Screen on (SR1000)

Silk Screen
This can be a LPI, or a Screen on type of ink. Colors that are normal available are white, black, and yellow.

Inspection

Final Finish
This can be HASL, ENIG, Immersion Tin, Immersion Silver or OSP/Entech (Cu.)

Inspection

Electrical Test

NC Rout

X Sections

Final Inspection

Bag & Tag & Ship

 

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Last Update 9/22/08