On this site, you will find all kinds of information about printed circuit boards. Most of the information is broken down into categories that include links and overviews.

New Site Format!!! 

 

My personal mission is to help provide answers to the many questions that people seem to have about circuit board designing and the manufacturing processes of printed Circuit boards (PCBs).

 

Please take your time and look around this site. I will be adding information on a regular basis…

 

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

These are some of the most commonly used words and terms when talking about the layout, manufacture or assembly of printed circuit board.


A

Annular Ring: This is the amount of metal from the drill hole to the edge of the metal pad. Inner layer annular ring is measured from the edge of the material where drill tool cut through to the edge of the pad. Outer layer annular ring is measured from the plated edge inside the hole to the edge of the pad including the finish platting wrap if any.
Au: This is the symbol for Gold which is a chemical element that is highly conductive

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B

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C

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D

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E

ENIG: Electroless Nickle Immersion Gold
ENIPIG: Electroless Nickle, Immersion Palladium, Immersion Gold

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F

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G

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H

HAL: Hot Air Level, this is shiny (silver in color) finish of solder that is applied by a machine that dips the PCB panle into molten solder
HASL: Hot Air Solder Level, this is shiny (silver in color) finish of solder that is applied by a machine that dips the PCB panle into molten solder

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I

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J

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K

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L

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M

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N

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O

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P

PWB: Printed Wire Board
PCB: Printed Circuit Board

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Q

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R

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S

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T

topy

U

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V

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W

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X

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Y

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Z

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Material/Substrate Vendors

 

Shin-Etsu www.microsi.com

Produces quartz substrates that demonstrate excellent permeability and low thermal expansibility in the far-ultraviolet range. Shin-Etsu quartz substrates are most commonly used as photomask substrates for optical lithography and other applications that require ultra-high purity and high precision polished substrates. As far as polished substrates are concerned, quartz substrates have an advantage over regular glass substrates because they offer much better light transmission and thermal resistance over their counterparts.

 

 

This is a standard process flow for the manufacture of double sided printed circuit boards with a hot air solder level (HASL/HAL).
Now some manufacturers may add or removes several inspection step at key points in the process depending on the finish requested and manufacturing equipment available at their facility.

 

Quote / Order Placed  
CAM / Planning  
Material Release   
Drill   
Debur (sand surface smooth, clear holes from debris)  
Inspection  
Metallization (plate through holes)  
Photo Image / LDI  
Develop  
Inspection  
Copper & Solder Plate  
Etch  
Solder Strip  
Inspection  
Solder Mask  
Silk Screen  
Inspection / Cure Bake  
HASL (Hot Air Solder Level or HAL)  
Inspection  
Test  
Rout  
Final Inspection  
Shipping