Terms
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Annular Ring: This is the measured distance between the drilled hole and the edge of a pad. When Measuring an outer layer you are counting the hole wall plating. For inner layers it is measured from the edge of the hole to the edge of the pad.
AOI: Automated Optical Inspection, These machines are used in place of a person who visually inspects PCB during construction looking for errors. These errors are most commonly shorts or opens.
ATE: Automated Test Equipment
AXI: Automated X-Ray Inspection
BOM: Bill of Materials, this is a list of the items that are needed to complete the assembly or manufacture of a product.
BST: Boundary Scan Test
CAD: Computer Aided Design
CAM: Computer Aided Manufacture
Component Side: this is an older term that was used to describe the top side of a circuit board. An good example of this term would be a 2 layer (double sided) circuit board where the components were placed through the top of the board and soldered on the bottom side (Solder Side).
Circuits: (aka: traces or tracks) the metal lines that will carry the current to your components.
DFM: Design for manufacture, The importance of this is to design your PCB board so that it is build able by a majority of manufacturers. This is important is you want to get your boards made fast and at a good price. There is an exception, if you are developing a new technology and are not afraid to spend some time and money.
DRC: Design Rule Checks, All board shops run a series of DRC. These are the stop gaps to prevent data issues from getting out to the manufacturing floor which causes scrap. We all know that scrap cost you and the manufacture money. Normal DRC will include space checks like: pad2pad, pad2trace, pad2route, trace2trace, trace2rout, drill2metal, drill2trace, drill2rout, etc.
EOLT: End of the line Testing
ENIG: Electroless Nickel Immersion Gold. The most common amount of nickel is between 100-150 micro inches thick. The most common amount of gold for ENIG is 6-8 micro inches thick.
ENPIG: Electroless Nickel Palladium Immersion Gold.
FCT: Functional Circuit Test
FPT: Flying Probe Tester
FUT: Functional Unit Test
ICT: In-Circuit Test
IEEE: Institute of Electrical and Electronics Engineers (read I-Triple-E)
OEM: Original Equipment Manufacturer
OSP: Organic Solderability Preservative. This is a low cost lead free corrosion inhibitor.
PCB: Printed Circuit Board
PWB: Printed Wire Board
