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Multilayer Process

 

    The Manufacturing Process (Multilayer)

This page will provide a quick overview of the manufacturing processes involved in making a normal circuit board.

Design Data, most PCB manufactures will want you to provide Gerber data with an Excellon type drill file. Also To help ensure your Gerber data matches your design systems data you should provide a netlist file that you PCB manufacturer can utilize. 

Original Customer
Data

CAM
Run DRC, add coupons,
Panelize, serialize
Create Drill & Rout Programs

Photo Plot Film
AOI, Punch, Inspect Artwork

Material Release

Photo Image

Inspect/Touch up

Etch

Strip Resist

AOI & Inspect

Lamination

NC Drill
Plated Holes, Plated Slots
& tented Non Plated holes

Clean & Inspect

Hole Metallization
This can be a simple permanganate line, Shadow line, or a DMSE line.

Copper Flash
this process adds an initial plating of copper to the entire surface and the holes that are to be platted.

Resist Coating

Photo Image
Exposes circuit patterns then developed

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Last Update 8/09/08