ITEQ Corporation is a leading manufacturer of high-performance copper clad laminate materials used for the fabrication of printed circuit boards and was founded in April of 1997, maintaining its headquarters at No.17, Daluge Rd., Xinpu Township, Hsin Chu County, Taiwan.
ITEQ’s products find use many different application areas, such as computational and communications applications (e.g. servers, storage, switches), Radio Frequency and Microwave devices (e.g. 5G and mmWaves), Automotive applications (e.g. advanced driver assist systems), and High-Density Interconnect solutions (e.g. smartphones).
ITEQ is driven to provide the leading-edge, first-to-market materials solutions to the problems of the future for the electronics industry. ITEQ has been focusing on enabling materials solutions for emerging technologies, such as 5G, IoT, autonomous driving, and extremely high-speed digital applications (>112 Gbps per channel and beyond).
ITEQ is committed to the highest standards of quality and reliability of its materials product offerings and is continuously investing in top of the line equipment and personnel for advanced testing and validation. ITEQ’s strong emphasis on research and development holds it at the frontier of halogen-free and high-performance materials suitable for lead-free and high-reliability processes. ITEQ provides total, cost-effective solutions for the industry as a one-stop shop of rigid, flex, halogen-free, environment-friendly materials.
In order to live up to its promise of providing the leading-edge solutions, ITEQ is also continuously investing in advanced research and development and innovation. The technology center in Taiwan includes a well-staffed, multidisciplinary product development team, as well as applications engineering group. Further, the technology center also includes a state of the art analytical and failure analysis lab, signal integrity and material characterization lab, and pilot scale facility for scale-up of new products.
IT-180G no/low flow prepreg is a halogen-free High Tg (>170℃ by DSC) multifunctional epoxy. It’s designed for rigid-flex board and heat sink bonding application.
IT-180I is a standard loss, high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability. It is designed for high layer count PCB and it can pass 260℃ Lead-free assembly process.
IT-180A is an advanced high Tg (170℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for the various application and can pass 260℃ lead-free assembly.
IT-189 is an advanced high Tg (170℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It’s suitable for automotive applications with 260℃ lead-free assembly.
IT-180 is an advanced high Tg (170℃ by DSC) multifunctional epoxy based on high thermal reliability and CAF resistance. It’s suitable for the various application and can pass 260℃ lead-free assembly.
IT-859GTA is a Tg of 100℃ (by DSC) halogen-free multifunctional filled epoxy with metal base and glass fabric reinforced laminate. It has a good thermal conductivity of 3W/mK. It also provides high thermal reliability and can pass 260℃ Lead-free assembly
IT-158 is a medium Tg (>150℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for the various application and can pass 260℃ lead-free assembly.